Qualcomm Technologies, Inc. is seeking a Thermal Engineer to join their Engineering Group in Santa Clara, CA. The role involves developing high-performance, energy-efficient server solutions for data center applications.
About the Role
As a Thermal Engineer, you will work closely with the platform team to conduct thermal simulations, testing, and characterization to validate and improve thermal models for high-performance computing systems. Key responsibilities include performing thermal modeling, supporting thermal design, collaborating with internal teams, conducting thermal testing, researching thermal management materials, and preparing technical documentation.
About You
Required:
Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
5+ years of hands-on experience in thermal modeling within the high-tech industry.
Strong background in heat transfer fundamentals.
Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak).
Understanding of electronics cooling technologies.
Knowledge of packaging technologies and thermal management materials.
Proven ability to work independently and collaboratively.
Strong technical documentation skills.
Preferred:
Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field.
10+ years of hands-on experience in thermal modeling.
Understanding of OCP product designs and industry best practices.
Engineering design experience with high-end servers.
Expertise in conducting CFD simulations.
Proficiency with thermal testing tools.
Proficiency in programming languages (e.g., Python, C/C++, MATLAB).
Experience with CAD tools (e.g., SolidWorks, Creo).
Benefits
Competitive annual discretionary bonus program.
Opportunity for annual RSU grants.
Comprehensive benefits package designed to support work-life balance.